“AMD EPYC server CPU achieving record market share gains at hyperscalers. Data Center segment $3.6B (+57% Y/Y), driven by EPYC Genoa and Turin deployments. AMD now estimated at 33%+ of new hyperscaler CPU socket awards — up from 22% two years ago. Intel Xeon losing share on every new contract cycle.”
“MI350 AI GPU (successor to MI300X) entering production with HBM3E at 288 GB per chip — the highest memory capacity of any AI accelerator. AMD securing GPU contracts at Microsoft Azure, Meta, and Oracle. MI350 competing directly with NVIDIA H200 on memory bandwidth. Revenue contribution still small vs. NVIDIA but growing rapidly — on track for $5B+ AI GPU revenue in FY26.”
“AMD competing for TSMC CoWoS advanced packaging capacity behind NVIDIA's priority reservation. EPYC CPUs use TSMC SoIC chiplet packaging; MI350 GPUs use CoWoS-L for HBM integration. AMD management acknowledged packaging capacity as a constraint on MI350 ramp — a constraint created by NVIDIA's supply reservation rather than AMD's own demand profile.”
“Ryzen AI 300 series (client CPU) with integrated NPU qualifying for Microsoft Copilot+ PC requirements. Client segment +23% Y/Y as AI PC upgrade cycle begins. AMD gaining PC CPU share from Intel in both desktop and laptop — first time in a decade AMD has grown client share while Intel simultaneously loses server share.”
“Gaming segment -40% Y/Y as Sony PlayStation 5 and Microsoft Xbox Series X/S approach end-of-cycle. AMD's semi-custom gaming console revenue declining sharply with no new console design wins announced for next generation. Gaming has dropped from 25% of AMD revenue to under 10% — structural decline, not cyclical.”