DRAM, HBM, NAND flash, and CXL — the storage and memory layers powering AI infrastructure.

GPUs, CPUs, and logic chips driving AI training, inference, and cloud workloads.

Co-packaged optics, optical fiber, and silicon photonics enabling AI cluster interconnects.

EUV and DUV lithography tools — the machines that make every chip.

Advanced packaging, cooling, and critical materials in the physical stack beneath every AI chip.

Grid transformers, solar, and power infrastructure enabling the AI data center buildout.